Materiały Elektroniczne 2008 T.36 nr 4
Bukat Krystyna ; Kościelski Marek
Bibliogr. s. 169 ; 157-170 s. : il. 24 cm.
ITME, sygn. dostępny ; click here to follow the link
Copyright-protected material. May be used within the limits of statutory user freedoms
Institute of Electronic Materials Technology
Library of the Electronic Materials Technology Institute
Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund
Oct 2, 2020
Jul 10, 2012
2354
https://rcin.org.pl./publication/16199
Edition name | Date |
---|---|
Sitek Janusz, 2008, Assembly and solidering problems in Leadfree through hole reflow technique | Oct 2, 2020 |
Stankiewicz, Rafał.