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Materiały Elektroniczne 2009 T.37 nr 1
Bibliogr. s. 72 ; 59-72 s. : il. 24 cm.
ITME, sygn. dostępny ; click here to follow the link
Copyright-protected material. May be used within the limits of statutory user freedoms
Institute of Electronic Materials Technology
Library of the Electronic Materials Technology Institute
Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund
Oct 2, 2020
Jul 12, 2012
597
https://rcin.org.pl./publication/16208
Edition name | Date |
---|---|
Borecki Janusz, Analysis blind microvias forming process in multilayer printed circuit boards | Oct 2, 2020 |
Stankiewicz, Rafał.