Thermal residual stress state in laser diode/heatsink joint systems depending on the properties of the heatsink material. FEM analysis - Digital Repository of Scientific Institutes

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Thermal residual stress state in laser diode/heatsink joint systems depending on the properties of the heatsink material. FEM analysis

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Title: Thermal residual stress state in laser diode/heatsink joint systems depending on the properties of the heatsink material. FEM analysis

Creator:

Kaliński Dariusz

Date issued/created:

Resource type:

Subtitle:

Materiały Elektroniczne 2002 T.30 nr 3

Publisher:

Place of publishing:

Description:

15-27 s. : il. 24 cm. ; Bibliogr. s. 27

Relation:

Electronic Materials

Volume:

Issue:

Start page:

End page:

Detailed Resource Type:

Format:

application/pdf

Resource Identifier:

oai:rcin.org.pl:17715

Source:

ITME, sygn. dostępny ; click here to follow the link

Language:

Rights:

Rights Reserved - Free Access

Terms of use:

Copyright-protected material. May be used within the limits of statutory user freedoms

Digitizing institution:

Institute of Electronic Materials Technology

Original in:

Library of the Electronic Materials Technology Institute

Projects co-financed by:

Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund

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Subject and keywords:

Electronic - materials Electronic - journal - materials laser diode heatsink diode-heatsink joint

Object collections:

Last modified:

Oct 2, 2020

In our library since:

Nov 28, 2012

Number of object content downloads / hits:

327

All available object's versions:

https://rcin.org.pl./publication/15554

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MATERIAŁY ELEKTRONICZNE

Edition name	Date
Kaliński Dariusz, Thermal residual stress state in laser diode/heatsink joint systems depending on the properties of the heatsink material. FEM analysis	Oct 2, 2020

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