Title:

Obudowy z tworzyw sztucznych przeznaczone do hermetyzacji mikroukładów hybrydowych = Plastics envelopes intended for encapsulation of hybride microcircuits

Subtitle:

Materiały Elektroniczne 1973 nr 3

Creator:

Nowacki Janusz

Contributor:

Szyszej Katarzyna

Publisher:

Wydaw. Przemysłu Maszynowego "WEMA"

Place of publishing:

Warszawa

Date issued/created:

1973

Description:

s. 39-43 : il. ; 24 cm.

Subject and Keywords:

Electronic - journal - materials ; Electronic - materials ; hybrid microcircuit ; encapsulation

Relation:

Electronic Materials

Issue:

3

Start page:

39

End page:

43

Resource type:

Text

Detailed Resource Type:

Article

Format:

application/pdf

Source:

ITME, sygn. dostępny ; click here to follow the link

Language:

pol

Rights:

Rights Reserved - Free Access

Terms of use:

Copyright-protected material. May be used within the limits of statutory user freedoms

Digitizing institution:

Institute of Electronic Materials Technology

Original in:

Library of the Electronic Materials Technology Institute

Projects co-financed by:

Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund

Access:

Open