Title:

Badanie wpływu miedzi na zmiane współczynnika liniowej rozszerzalności cieplnej spieku W-Cu = Copper influence on the linear thermal expansion coefficient changes of the W-Cu sinter

Subtitle:

Materiały Elektroniczne 1976 nr 3(15)

Creator:

Lejbrandt Marek

Publisher:

Wydaw. Przemysłu Maszynowego WEMA

Place of publishing:

Warszawa

Date issued/created:

1976

Description:

s. 42-45 : il. 24 cm. ; Bibliogr. s. 45

Subject and Keywords:

Electronic - materials ; Electronic - journal - materials ; linear thermal expansion ; W-Cu sinter

Relation:

Electronic Materials

Volume:

15

Issue:

3

Start page:

42

End page:

45

Resource type:

Text

Detailed Resource Type:

Article

Format:

application/pdf

Source:

ITME, sygn. dostępny ; click here to follow the link

Language:

pol

Rights:

Rights Reserved - Free Access

Terms of use:

Copyright-protected material. May be used within the limits of statutory user freedoms

Digitizing institution:

Institute of Electronic Materials Technology

Original in:

Library of the Electronic Materials Technology Institute

Projects co-financed by:

Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund

Access:

Open