Metadata language
Materiały Elektroniczne 2009 T.37 nr 3
Creator: Contributor:Kaliński Dariusz ; Pietrzak Katarzyna ; Golański Dariusz
Publisher: Place of publishing: Date issued/created: Description:Bibliogr. s. 29 ; 21-29 s. : il. 30 cm.
Subject and Keywords:Electronic - journal - materials ; Electronic - materials ; thermal residual stresse ; heat-sink material ; ceramic-cooper junction
Relation: Volume: Issue: Start page: End page: Resource type: Detailed Resource Type: Format: Source:ITME, sygn. dostępny ; click here to follow the link
Language: Rights: Terms of use:Copyright-protected material. May be used within the limits of statutory user freedoms
Digitizing institution:Institute of Electronic Materials Technology
Original in:Library of the Electronic Materials Technology Institute
Projects co-financed by:Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund
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