Title:

Naprężenia własne termiczne w spajanych elementach ceramiki AIN z miedzią = Thermal residual stresses in joined elements of AIN ceramics to copper

Subtitle:

Materiały Elektroniczne 2000 T.28 nr 3

Creator:

Kaliński Dariusz

Contributor:

Olesińska Wiesława

Publisher:

ITME

Place of publishing:

Warszawa

Date issued/created:

2000

Description:

50-62 s. : il. 24 cm. ; Bibliogr. s. 62

Subject and Keywords:

Electronic- materials ; residual stress ; ceramic metal joint ; direct-bonding ; Electronic - journal - materials

Relation:

Electronic Materials

Volume:

28

Issue:

3

Start page:

50

End page:

62

Resource type:

Text

Detailed Resource Type:

Article

Format:

application/pdf

Source:

ITME, sygn. dostępny ; click here to follow the link

Language:

pol

Rights:

Rights Reserved - Free Access

Terms of use:

Copyright-protected material. May be used within the limits of statutory user freedoms

Digitizing institution:

Institute of Electronic Materials Technology

Original in:

Library of the Electronic Materials Technology Institute

Projects co-financed by:

Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund

Access:

Open