Metadata language
Materiały Elektroniczne 1997 T.25 nr 1
Creator: Contributor: Publisher: Place of publishing: Date issued/created: Description:17-30 s. : il. ; 24 cm. ; Bibliogr. s. 30
Subject and Keywords:Electronic - materials ; metal stencil ; solder paste ; SMT
Relation: Volume: Issue: Start page: End page: Resource type: Detailed Resource Type: Format: Source:ITME, sygn. dostępny ; click here to follow the link
Language: Rights: Terms of use:Copyright-protected material. May be used within the limits of statutory user freedoms
Digitizing institution:Institute of Electronic Materials Technology
Original in:Library of the Electronic Materials Technology Institute
Projects co-financed by:Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund
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