Metadata language
Joining of carbon fibre - copper composite to metals
Subtitle:Materiały Elektroniczne 1993 T.21 nr 4
Creator: Publisher: Place of publishing: Date issued/created: Description:55-62 s. : il. ; 24 cm. ; Bibliogr. s. 62
Subject and Keywords:Electronic - materials ; Electronic - journal - materials ; carbon fibre-copper composite ; bonding ; metal
Relation: Volume: Issue: Start page: End page: Resource type: Detailed Resource Type: Format: Source:ITME, sygn. dostępny ; click here to follow the link
Language: Rights: Terms of use:Copyright-protected material. May be used within the limits of statutory user freedoms
Digitizing institution:Institute of Electronic Materials Technology
Original in:Library of the Electronic Materials Technology Institute
Projects co-financed by:Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund
Access: