Title:

Model dobierania warunków dyfuzji Mn- Cu dla zachowania wysokiego przewodnictwa cieplnego folii miedzianej = The model for choosing Mn-Cu diffusion conditions to maintain high thermal conductivity of cooper foil

Subtitle:

Materiały Elektroniczne 1986 nr 2(54)

Creator:

Riedl Władysław

Publisher:

Wydaw. Przemysłu Maszynowego "WEMA"

Place of publishing:

Warszawa

Date issued/created:

1986

Description:

s. 31-40 : il. ; 24 cm. ; Bibliogr. s

Subject and Keywords:

Electronic - journal - material ; Electronic materials ; thermal conductivity ; diffusion p-n junction ; copper foil

Relation:

Electronic Materials

Volume:

54

Issue:

2

Start page:

31

End page:

40

Resource type:

Text

Detailed Resource Type:

Article

Format:

application/pdf

Source:

ITME, sygn. dostępny ; click here to follow the link

Language:

pol

Rights:

Rights Reserved - Free Access

Terms of use:

Copyright-protected material. May be used within the limits of statutory user freedoms

Digitizing institution:

Institute of Electronic Materials Technology

Original in:

Library of the Electronic Materials Technology Institute

Projects co-financed by:

Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund

Access:

Open